RRP Electronics Inaugurates Advanced Wafer-Level Packaging Facility in Navi Mumbai to Expand Semiconductor Capabilities

Semiconductor-ltd-104346">RRP Electronics Ltd inaugurated a new Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor manufacturing unit in Navi Mumbai, Maharashtra, on October 12, 2026. The expansion marks another milestone in the company's semiconductor manufacturing journey and strengthens its capabilities in advanced packaging, connectivity modules and specialised semiconductor applications.

The facility was inaugurated by Shri Uday Samant, Cabinet Minister for Industries and Marathi Language, Government of Maharashtra; Dr. Anil Kakodkar; Dr. G. Satheesh Reddy; and Rajendra Chodankar, Chairman of RRP Electronics Ltd.

The new facility expands the company's existing Outsourced Semiconductor Assembly and Test (OSAT) capabilities and supports its vision of developing a self-sustaining semiconductor manufacturing ecosystem in India, spanning wafer processing, packaging, advanced packaging, testing and module manufacturing.

RRP Electronics has already established conventional semiconductor packaging capabilities, including Quad Flat No-lead (QFN) packaging, with solutions deployed for customers and organisations. The addition of advanced wafer-level packaging expands its portfolio to address increasingly complex semiconductor and electronics applications.

Advanced wafer-level packaging enables integrated circuits to be packaged and interconnected while they remain part of the semiconductor wafer, before being separated into individual chips. Unlike conventional packaging, in which chips are separated and packaged individually, AWLP forms protective layers and electrical interconnections across the wafer through a sequence of manufacturing processes. As further transistor miniaturisation becomes increasingly difficult and expensive, the technology is gaining importance in the development of compact, high-performance electronic devices.

A key application area for the new facility will be SIM and embedded module manufacturing. RRP Electronics plans to offer manufacturing capabilities for wire-bonded SIM modules, flip-chip-bonded SIM modules, eSIM and embedded connectivity modules, and advanced semiconductor modules and packages. These capabilities are intended to support customers requiring compact, secure and highly integrated semiconductor-based connectivity solutions.

The integration of AWLP with the company's existing OSAT infrastructure is expected to provide customers with a broader manufacturing ecosystem, covering semiconductor packaging and assembly, testing and module-level solutions. The expansion is also intended to create additional revenue-generation opportunities as the company broadens its manufacturing offerings.

Alongside the new packaging line, RRP Electronics is strengthening its semiconductor testing infrastructure to support specialised devices and applications. The enhanced infrastructure will support its planned packaging of Monolithic Microwave Integrated Circuits (MMICs), which are specialised semiconductor devices designed for high-frequency applications. MMICs are widely used in radar, communications and other advanced electronic systems. The ability to undertake specialised packaging for these devices would expand the company's capabilities in more complex semiconductor applications.

The latest investment builds on RRP Electronics' ongoing efforts to develop semiconductor manufacturing capabilities in India. From its existing OSAT operations and QFN packaging capabilities, the company is expanding into advanced wafer-level packaging, flip-chip and wire-bonded modules, SIM/eSIM manufacturing, and specialised semiconductor packaging and testing. The progression forms part of its broader objective of building an integrated semiconductor ecosystem that serves customers across multiple stages of the semiconductor value chain.

Rajendra Chodankar, Chairman of RRP Electronics Ltd., said the new facility marked an important milestone in the company's semiconductor journey. He noted that the company had established its OSAT capabilities and deployed QFN packages for customers before expanding into advanced wafer-level packaging, specialised SIM and eSIM module manufacturing, and enhanced testing capabilities. He added that RRP Electronics aims to continuously expand its capabilities and develop a more integrated semiconductor manufacturing platform in India to serve the evolving requirements of the telecom, industrial, automotive, Defence and strategic electronics sectors.

The inauguration of the AWLP facility marks another step in RRP Electronics' efforts to build a broader semiconductor manufacturing platform in India, with capabilities spanning conventional and advanced packaging, testing and electronic module manufacturing.

RRP Electronics Ltd. is engaged in semiconductor packaging, assembly, testing and advanced semiconductor manufacturing solutions. The company operates its semiconductor facility in Navi Mumbai, Maharashtra, with capabilities spanning OSAT, QFN/DFN, Ball Grid Array (BGA), flip-chip packaging, wire bonding, wafer processing, SIM/eSIM modules and advanced packaging solutions. It aims to expand its manufacturing capabilities and support customers across telecommunications, automotive, industrial, defence and strategic electronics while contributing to the development of India's semiconductor ecosystem.

Disclaimer: The article is for informational purposes only and not investment advice.